logo

Basics of cleanroom infrastructure; semiconductor crystal growth and wafering; wafer cleaning; thin film deposition of semiconductors, dielectrics, and metals; lithographical structuring; wet and dry (plasma) etching, p/n-junctions and diodes, device simulations, MOS-capacitors and capacitance-voltage (C-V) measurements, MOS-FETs and transistor technology. Selected processing steps on silicon wafers carried out in the Central Cleanroom Laboratory are demonstrated in videos.

The following course/module was developed at the TU Bergakademie Freiberg.

Learning outcomes / Competencies:

Students will get familiar with processes, methods, and equipment typically used in semiconductor cleanrooms, both in research institutes and industry. The module will enable the students to recognize suitable technologies for the micro- and nano-structuring of thin films of semiconductors, dielectrics, or metals. Furthermore, students will be able to describe the basics of simple semiconductor devices such as diodes or transistors, i.e., how they are fabricated and how they operate.

Prof. Dr. Daniel Hiller

Prof. Dr. Daniel Hiller

Institute of Applied Physics

TU Bergakademie Freiberg

0 Reviews

Add a Review

You May Also Like

Struktur der Materie I: Festkörper

Struktur der Materie I: Festkörper

  • Format:

    Self-paced online
  • Workload:

    28 lectures